PET Printed Silver Paste Circuit Filling

The PET silver paste circuit filling process is a flexible circuit formed by attaching conductive silver paste to a PET film through screen printing. It can be made into a double-layer circuit and is used to replace the traditional copper foil circuit (FPC). It is suitable for lightweight and low-cost electronic devices.

Core advantages

Flexible and bendable PET substrate is resistant to bending (bending radius can be as small as 3mm), making it suitable for dynamic applications.
High conductivity The volume resistivity of silver paste can reach 5×10⁻⁵ Ω·cm (Approximately 10% of bulk silver).
Simple process No etching is required; the product can be directly printed, shortening the production cycle.
Low cost The cost is reduced by 50% compared to FPC lines.
Thin The total thickness can be controlled within 0.1~0.3mm (Including substrate and silver layer).

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